This is a 20-layer HDI PCB with any layer interconnection structure, manufactured via 9 lamination cycles, finished board thickness 2.8mm. Adopting stacked microvias technology, it realizes electrical connection between arbitrary layers, delivering ultra-high wiring density and stable high-speed signal performance.

This 20-layer any layer HDI PCB is widely used in high-speed servers, data communication equipment, high-end network switches, radar, aerospace and high-reliability industrial control systems. The any-layer stacked microvia structure greatly improves wiring density, shortens signal transmission path, reduces signal loss and crosstalk, ensuring stable high-speed signal integrity under high-frequency working conditions. It can help customers miniaturize device size while maintaining excellent electrical performance.

We support customized stack-up design, various surface finishes including ENIG, HASL, OSP, Hard Gold, Immersion Silver. Strictly produced per IPC-A-600 standards. Available for prototype, small batch and mass production.