BT Resin PCB IC Substrate, BGA Packaging Substrate

Our BT resin IC substrate (Bismaleimide Triazine substrate) is a high-performance packaging substrate specially designed for BGA, CSP and advanced semiconductor chip packaging applications.

BT material features ultra-high Tg, excellent thermal stability, low thermal expansion coefficient and reliable dielectric performance, ideal for high-density fine pitch interconnection of semiconductor packages.

Core Advantages

✅ High Tg BT Resin substrate, Tg＞250℃, outstanding heat resistance

✅ Fine pitch fabrication capability: Min line width 3mil (0.075mm), Min spacing 2mil (0.05mm)

✅ Advanced via technology: Blind via, buried via & through-hole available, via diameter down to 50μm

✅ Multiple surface finish: ENIG, ENEPIG, OSP for different chip bonding requirements

✅ Customizable layers: 2~12 layers, core thickness from 40μm to 200μm

✅ RoHS compliant, ISO9001 certified

✅ Prototype & mass production available, small MOQ accepted

Specifications

• Material: BT Resin (Bismaleimide Triazine)
• Layer Count: 2 – 12 Layers
• Minimum Line Width: 3 mil (0.075 mm)
• Minimum Spacing: 2 mil (0.05 mm)
• Via Diameter: 50 – 100 μm
• Via Type: Blind, Buried, Through-hole
• Core Thickness: 40 – 200 μm
• Surface Finish: ENIG, ENEPIG, OSP
• Operating Temperature: -40℃ ~ 150℃
• Max Board Size: Customizable up to 600mm × 600mm
• Compliance: RoHS, ISO9001

Application

IC packaging, BGA packaging, CSP, semiconductor devices, high-density microelectronic modules.

About JQPCB

JQPCB is a professional manufacturer for high-end PCB & IC substrates. We provide one-stop service from Gerber review, prototype trial to volume mass production. Send us your Gerber files and specs for quotation.

Jiaqing Circuit was founded in 2012 in Shenzhen, China. We own a 5,000 square meter manufacturing plant with a monthly PCB production capacity of 20,000 square meters, capable of manufacturing 2-48 layer PCBs.

We deliver one-stop solutions including PCB design, PCB fabrication, BOM component sourcing and SMT assembly. Our products serve high-end industries such as automotive electronics, industrial control, AI computing, telecommunications and medical electronics.

With mature manufacturing processes and stable supply-chain support, we handle rapid prototyping, small-batch and mass-production orders. We strive to provide reliable custom-printed circuit board solutions for global high-tech electronics customers.