This 16 layers high TG backplane PCB adopts M6 high-performance material, featuring high thermal resistance and excellent high-speed signal transmission performance.

Finished board thickness reaches 3.0mm, copper thickness 1OZ, surface treatment with immersion gold, stable and reliable for plug-in and long-term operation.
Minimum trace & space: 4mil (0.1mm), supports fine line routing for complex interconnection design.

Backplane PCB is the core interconnection carrier for communication equipment. This multilayer backplane can connect multiple functional boards, realize high-speed data transmission between modules. It has good structural stability, low signal loss and strong anti-interference capability, widely used in communication servers, industrial control and high-speed computing systems.

We support customized multilayer backplane PCB with different layers, materials and sizes. Welcome to send Gerber files for inquiry and instant quotation.